Нитрид бора: незаменим для полупроводниковых вакуумных печей

  In the semiconductor industry, boron nitride (BN) plays a crucial role in vacuum furnace applications due to its exceptional properties. Vacuum furnaces are essential for various semiconductor manufacturing processes, including annealing, diffusion, and chemical vapor deposition (CVD).
Boron nitride components are widely used in these vacuum furnaces for several reasons:

• High-Temperature Stability: Boron nitride exhibits excellent thermal stability and can withstand temperatures up to 2,000°C in an inert atmosphere or vacuum environment, making it suitable for high-temperature semiconductor processes.

• Chemical Inertness: Boron nitride is chemically inert and resistant to most acids, bases, and solvents, ensuring compatibility with various semiconductor materials and process gases.

• Electrical Insulation: With excellent electrical insulation properties, boron nitride prevents short circuits and maintains electrical isolation in semiconductor devices.

• Thermal Conductivity: Boron nitride possesses good thermal conductivity, facilitating efficient heat transfer and uniform temperature distribution within the vacuum furnace.

Common boron nitride components used in semiconductor vacuum furnaces include:

• Crucibles and Containers: Used for holding semiconductor wafers or materials during high-temperature processes.

• Liners and Insulation Materials: Protect furnace walls and maintain desired temperature profiles.

• Fixtures and Holders: Position and support semiconductor wafers or components during processing.

• Shields and Baffles: Control gas flow and prevent cross-contamination.

  The exceptional thermal, chemical, and electrical properties of boron nitride make it indispensable in semiconductor vacuum furnace applications, contributing to the efficient and reliable production of advanced semiconductor devices.