Silicon Nitride Ceramic(Si3N4)

Silicon Nitride Ceramics are advanced ceramics primarily composed of nitrides, with two main crystalline forms: α-silicon nitride and β-silicon nitride. Depending on the sintering process, they are categorized into hot-pressed silicon nitride and reaction-bonded silicon nitride.
Sintering Processes
Hot-Pressed Silicon Nitride
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- This type is made by pressing silicon nitride powder into a mold and sintering it at 1700°C under 20-30 MPa pressure.
- It produces dense, pore-free ceramics with excellent flexural strength and toughness.
Reaction-Bonded Silicon Nitride
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- It starts with silicon (Si) or silicon nitride (Si₃N₄) powder, which is shaped and then heated in a nitrogen-rich atmosphere to form silicon nitride (Si + N₂ → Si₃N₄).
- The final products are highly precise in dimensions but contain 20%-30% porosity, which makes them less strong, hard, and tough compared to hot-pressed silicon nitride.
Among all ceramics, silicon nitride offers the best thermal shock resistance.
Main Features of Silicon Nitride Ceramic
- Excellent self-lubrication and wear resistance
- Low thermal expansion coefficient
- Outstanding thermal shock resistance
- High hardness and a low friction coefficient (0.1-0.2)
- Good chemical stability and electrical insulation
Silicon Nitride Ceramic Property Chart
Property | Units | Silicon Nitride (Si₃N₄) |
General | ||
Color | — | Black |
Gas Permeability | atms-cc/sec | Gas tight < 10⁻¹⁰ |
Water Absorption | % | 0 |
Density | g/cm³ | 3.20 |
Mechanical Properties | ||
Hardness Vickers 500 gm | GPa (kg/mm²) | 15 (1529) |
Hardness (R45N) | — | 83 |
Fracture Toughness( Notched Beam) | MPa·m¹/² | 6 |
Flexural Strength (MOR) | MPa (psi x 10³) | 900 (130) |
Tensile Strength @ RT | MPa (psi x 10³) | 537 (78) |
Compressive Strength @ RT | MPa (psi x 10³) | 2500 (362) |
Elastic Modulus | GPa (psi x 10⁶) | 300 (44) |
Poisson’s Ratio | — | 0.28 |
Thermal Properties | ||
C.T.E. (25 – 600°C) | x 10⁻⁶/°C | 2.9 |
Thermal Conductivity @ RT | W/m·K | 29 |
Max Use Temp | Fahrenheit (°F) | 2462 |
Max Use Temp | Celsius (°C) | 1350 |
Electrical Properties | ||
Dielectric Strength | V/mil | 300 |
Dielectric Constant @ 1 MHz | — | 9.1 |
Volume Resistivity, 25°C | ohms-cm | > 10¹⁴ |
*The values represent typical material properties and may vary depending on product configuration and the manufacturing process,
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Silicon Nitride Ceramic Applications
Hot-Pressed Silicon Nitride (HPSN)
- Cutting tools
- Simple-shaped parts for wear and high-temperature applications
- Bearing components
Reaction-Bonded Silicon Nitride (RBSN)
- Ideal for complex shapes requiring high precision
- Sealing rings in the petrochemical industry
- Gas turbine rotor blades
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