Typical aluminum nitride (AlN) ceramics can withstand temperatures up to 1000℃ without cracking due to rapid heating. The thermal shock resistance of standard AlN ceramics typically endures instantaneous temperature fluctuations of several hundred degrees Celsius.

The Performance and Properties of Alumina Nitride, AlN :
| Właściwości | Wartość |
| Gęstość spieku | 3.33 g/cm³ |
| Absorpcja wody | 0.00% |
| Wytrzymałość na zginanie | 285 MPa(20℃) |
| Współczynnik Poissons | 0.21 |
| Moduł ścinania | 128 GPa |
| Moduł sprężystości | 310 GPa(20℃) |
| Podział dielektryczny | 16000 V( 1.00 mm ) |
| Dielectric strength | >= 13.3 kV/mm @Thickness 1.50 mm |
| CTE, linear (300°C) | 4.20 µm/m-°C |
| Pojemność cieplna właściwa | 0.738 J/g-°C |
| Dielectric Constant (1e+6 Hz) | 9 |
| Rezystywność objętościowa | 1.00e+13 ohm-cm |
| Wskaźnik strat dielektrycznych | 0.00040 ( 1e+6 Hz) |
| CTE, linear (1000°C) | 5.60 µm/m-°C |
| Przewodność cieplna | 180 W/m-K(20℃) 159 W/m-K(70℃) |
| Wytrzymałość na zginanie | 300-400 MPa |
| Hardness, Vickers | 1100-1200 Hv |
Electronics and Semiconductor Applications:
In electronics packaging and semiconductor substrates, This Materials are widely utilized for thermal management and heat dissipation applications. These ceramics maintain stability within the temperature range of 200°C to 300°C. However, they can withstand higher instantaneous temperature variations, ensuring the reliability of electronic components and systems under thermal stress.
High-Temperature Mechanical Applications:
In high-temperature mechanical applications, such as heat exchangers and high-temperature insulators, it can operate effectively within the temperature range of 600°C to 1000°C. The specific tolerance to high temperatures also depends on mechanical stress and other operational conditions. These properties make AlN ceramics highly suitable for applications demanding robust performance under extreme thermal conditions.