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High-Temperature Stability and Thermal Shock Resistance of Typical Aluminum Nitride Ceramics
Typical aluminum nitride (AlN) ceramics can withstand temperatures up to 1000℃ without cracking due to rapid heating. The thermal shock resistance of standard AlN ceramics typically endures instantaneous temperature fluctuations of several hundred degrees Celsius.
The Performance and Properties of Alumina Nitride, AlN :
| Properties | Value |
| Sintered Density | 3.33 g/cm³ |
| Water Absorption | 0.00% |
| Flexural Strength | 285 MPa（20℃） |
| Poissons Ratio | 0.21 |
| Shear Modulus | 128 GPa |
| Modulus of Elasticity | 310 GPa（20℃） |
| Dielectric Breakdown | 16000 V（ 1.00 mm ） |
| Dielectric strength |
>= 13.3 kV/mm @Thickness 1.50 mm |
| CTE, linear (300°C) | 4.20 µm/m-°C |
| Specific Heat Capacity | 0.738 J/g-°C |
| Dielectric Constant (1e+6 Hz) | 9 |
| Volume Resistivity | 1.00e+13 ohm-cm |
| Dielectric Loss Index |
0.00040 （ 1e+6 Hz） |
| CTE, linear (1000°C) | 5.60 µm/m-°C |
| Thermal Conductivity |
180 W/m-K（20℃） 159 W/m-K（70℃） |
| Flexural Strength | 300-400 MPa |
| Hardness， Vickers | 1100-1200 Hv |
Electronics and Semiconductor Applications:
In electronics packaging and semiconductor substrates, This Materials are widely utilized for thermal management and heat dissipation applications. These ceramics maintain stability within the temperature range of 200°C to 300°C. However, they can withstand higher instantaneous temperature variations, ensuring the reliability of electronic components and systems under thermal stress.
High-Temperature Mechanical Applications:
In high-temperature mechanical applications, such as heat exchangers and high-temperature insulators, it can operate effectively within the temperature range of 600°C to 1000°C. The specific tolerance to high temperatures also depends on mechanical stress and other operational conditions. These properties make AlN ceramics highly suitable for applications demanding robust performance under extreme thermal conditions.
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