Aluminum Nitride Ceramic

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High-Temperature Stability and Thermal Shock Resistance of Typical Aluminum Nitride Ceramics

Typical aluminum nitride (AlN) ceramics can withstand temperatures up to 1000℃ without cracking due to rapid heating. The thermal shock resistance of standard AlN ceramics typically endures instantaneous temperature fluctuations of several hundred degrees Celsius.

The Performance and Properties of Alumina Nitride, AlN :

Properties	Value
Sintered Density	3.33 g/cm³
Water Absorption	0.00%
Flexural Strength	285 MPa（20℃）
Poissons Ratio	0.21
Shear Modulus	128 GPa
Modulus of Elasticity	310 GPa（20℃）
Dielectric Breakdown	16000 V（ 1.00 mm ）
Dielectric strength	>= 13.3 kV/mm @Thickness 1.50 mm
CTE, linear (300°C)	4.20 µm/m-°C
Specific Heat Capacity	0.738 J/g-°C
Dielectric Constant (1e+6 Hz)	9
Volume Resistivity	1.00e+13 ohm-cm
Dielectric Loss Index	0.00040 （ 1e+6 Hz）
CTE, linear (1000°C)	5.60 µm/m-°C
Thermal Conductivity	180 W/m-K（20℃） 159 W/m-K（70℃）
Flexural Strength	300-400 MPa
Hardness, Mohs	1100-1200 Hv

Electronics and Semiconductor Applications:

In electronics packaging and semiconductor substrates, This Materials are widely utilized for thermal management and heat dissipation applications. These ceramics maintain stability within the temperature range of 200°C to 300°C. However, they can withstand higher instantaneous temperature variations, ensuring the reliability of electronic components and systems under thermal stress.

High-Temperature Mechanical Applications:

In high-temperature mechanical applications, such as heat exchangers and high-temperature insulators, it can operate effectively within the temperature range of 600°C to 1000°C. The specific tolerance to high temperatures also depends on mechanical stress and other operational conditions. These properties make AlN ceramics highly suitable for applications demanding robust performance under extreme thermal conditions.

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